Electroplated copper foil/strip is a functional material produced by depositing a layer of other metals (such as tin, nickel, or gold) onto an electrolytic copper foil./strip substrate through an electrochemical process. This coating is primarily applied to enhance the foil/strip's solderability, corrosion resistance, or oxidation resistance, meeting specific requirements in fields like Industrial Electrical, printed circuit boards (PCBs) and lithium batteries.